ALEXANDRIA, Va., March 24 -- United States Patent no. 12,587,062, issued on March 24, was assigned to Hilti AG (Schaan, Liechtenstein). "Electric motor positioning apparatus including rubber pot" was... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,781, issued on March 24, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Electrochemical element, met... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,048, issued on March 24, was assigned to Fidelity Information Services LLC (Jacksonville, Fla.). "Systems and methods for real-time accoun... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,837, issued on March 24, was assigned to Institut national de recherche pour l'agriculture l'alimentation et l'environnement (Paris). "Dev... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. D1,119,634, issued on March 24, was assigned to Stanley Black & Decker Inc. (New Britain, Conn.). "Hand tool" was invented by Timothy J. Payne (C... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,066, issued on March 24, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Light-emitting device and electronic apparatu... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,795, issued on March 24, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Protection of data based on standards of s... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,418, issued on March 24, was assigned to Wacom Co. Ltd. (Saitama, Japan). "Host device and input-output system" was invented by Hideki Fuj... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,699, issued on March 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "System, method, and computer program for m... Read More
ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,557, issued on March 24, was assigned to NXP USA INC. (Austin, Texas). "Multichip packages with 3D integration" was invented by Zhiwei Gon... Read More